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What is the reason of poor refrigeration effect of Thermal Shock Tester refrigeration

Date: May 23,2023 Views: 272

The refrigeration effect of the Thermal Shock Tester may be poor for the following reasons:


1. Refrigeration system failure: Components of the refrigeration system such as condenser, evaporator and compressor may fail, leading to poor refrigeration effect. The refrigeration system needs to be inspected and repaired to ensure its normal operation.


2. Insufficient refrigerant or leakage: Insufficient refrigerant or leakage may affect the cooling effect. You need to add or replace refrigerant in a timely manner, and check for leakage points.


3. The ambient temperature is too high: if the ambient temperature around the test chamber is too high, the refrigeration effect of the test chamber will be affected. It is recommended to place the test chamber at a lower temperature or add an external cooling device to improve the cooling effect of the test chamber.




4. Excessive heat load: if the heat load inside the test chamber is too large, it will affect the refrigeration effect of the test chamber. It is necessary to appropriately reduce the heat load inside the test chamber, such as increasing the vent, reducing the number of samples, etc.


5. Damage to the insulation layer of the test box: the insulation layer of the test box is damaged or incomplete, resulting in the refrigeration system can not effectively control the temperature in the test box.


6. The test chamber door is not closed tightly: the test chamber door is not closed tightly, resulting in the temperature inside the test chamber cannot be kept stable.



he above is the common reason for the poor refrigeration effect of Thermal Shock Tester. If the refrigeration effect of Thermal Shock Tester  is poor, you can first check whether the above reasons exist, and repair the problem in time. If the above reasons cannot be solved, it is recommended to contact the test chamber manufacturer or "ring instrument" for maintenance and overhaul.




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