Failure acceleration due to Thermal Shock and Temp Cycling

Failure acceleration due to Thermal Shock and Temp Cycling depends on the following factors:  1) the difference between the high and low temperatures used; 2) the transfer time between the two temperatures; and 3) the dwell times at the extreme temperatures. 

Failure mechanisms accelerated by thermal shock include die cracking, package cracking, neck/heel/wire breaks, and bond lifting. 

For reliability testing or qualification of new devices, 1000 temp cycles are usually performed, with interim visual inspection and electrical test read points at 200X and 500X.

Two industry standards that govern Temp Cycle Testing are the Mil-Std-883 Method 1011 and the JEDEC JESD22-A106.

-  Total Transfer Time < 10 seconds

-  Total Dwell Time > 2 minutes

-  Specified Temp reached in < 5 minutes

-  Must be conducted for a minimum of 15 cycles